【Spotlights】National Yang Ming Chiao Tung University’s Successful Challenge to the Next-Generation Angstrom-Level Integrated Circuit Technology, with Potential to Go “More than Moore”

Full metadata record

DC Field	Value	Language
dc.contributor.author	國際事務處	zh_TW
dc.contributor.author	Office of International Affairs	en_US
dc.date.accessioned	2023-08-08T03:01:33Z	-
dc.date.available	2023-08-08T03:01:33Z	-
dc.date.issued	2023-08-01	en_US
dc.identifier.uri	https://www.nycu.edu.tw/news/4903/	en_US
dc.identifier.uri	http://hdl.handle.net/11536/161149	-
dc.description.abstract	National Yang Ming Chiao Tung University’s Successful Challenge to the Next-Generation Angstrom-Level Integrated Circuit Technology, with Potential to Go “More than Moore”	en_US
dc.language.iso	en_US	en_US
dc.publisher	國立陽明交通大學	zh_TW
dc.publisher	National Yang Ming Chiao Tung University	en_US
dc.title	【Spotlights】National Yang Ming Chiao Tung University’s Successful Challenge to the Next-Generation Angstrom-Level Integrated Circuit Technology, with Potential to Go “More than Moore”	en_US
dc.type	Historical News	en_US
dc.identifier.journal	陽明交大英文電子報	zh_TW
dc.identifier.journal	NYCU E-NEWS	en_US
dc.citation.issue	2023-07	en_US
Appears in Collections:	NYCU E-NEWS

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