完整後設資料紀錄
DC 欄位語言
dc.contributor.author國際事務處zh_TW
dc.contributor.authorSzu-Yung Huangen_US
dc.contributor.authorElaine Chuangen_US
dc.contributor.authorOffice of International Affairsen_US
dc.date.accessioned2024-02-20T23:53:33Z-
dc.date.available2024-02-20T23:53:33Z-
dc.date.issued2024-01-25en_US
dc.identifier.urihttps://www.nycu.edu.tw/nycu/en/app/news/view?module=headnews&id=552&serno=e2db7159-3dda-4c1b-8d47-28ed4b3c1499en_US
dc.identifier.urihttp://hdl.handle.net/11536/162610-
dc.description.abstractCollaborating with the Arm Semiconductor Education Alliance: Inspiring the Future of Chips, Cultivating Excellence in Technical Talenten_US
dc.language.isoen_USen_US
dc.publisher國立陽明交通大學zh_TW
dc.publisherNational Yang Ming Chiao Tung Universityen_US
dc.title【Spotlights】Collaborating with the Arm Semiconductor Education Alliance: Inspiring the Future of Chips, Cultivating Excellence in Technical Talenten_US
dc.typeHistorical Newsen_US
dc.identifier.journal陽明交大英文電子報zh_TW
dc.identifier.journalNYCU E-NEWSen_US
dc.citation.issue2024-01en_US
顯示於類別:陽明交大英文電子報


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  1. 2024 Newsletter_January-04.pdf

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