完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | 國際事務處 | zh_TW |
dc.contributor.author | Yen-Chien Lai | en_US |
dc.contributor.author | Office of International Affairs | en_US |
dc.date.accessioned | 2024-05-08T07:12:50Z | - |
dc.date.available | 2024-05-08T07:12:50Z | - |
dc.date.issued | 2024-03-28 | en_US |
dc.identifier.uri | https://www.nycu.edu.tw/nycu/en/app/news/view?module=headnews&id=552&serno=da196878-cc17-410c-b885-843c19b07382 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/162910 | - |
dc.description.abstract | National Yang Ming Chiao Tung University (NYCU) conferred an In February, the Department of Industrial Engineering and Management (IEM) at National Yang Ming Chiao Tung University (NYCU) and the semiconductor giant United Microelectronics Corporation (UMC) conducted a signing ceremony for their industry-academia collaboration, declaring their joint development of a semiconductor cross-fab capacity planning optimization system. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | 國立陽明交通大學 | zh_TW |
dc.publisher | National Yang Ming Chiao Tung University | en_US |
dc.title | 【Spotlights】Supporting UMC's digital transformation NYCU develops a semiconductor capacity planning system to optimize production operations efficiency | en_US |
dc.type | Historical News | en_US |
dc.identifier.journal | 陽明交大英文電子報 | zh_TW |
dc.identifier.journal | NYCU E-NEWS | en_US |
dc.citation.issue | 2024-03 | en_US |
顯示於類別: | 陽明交大英文電子報 |