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dc.contributor.author國際事務處zh_TW
dc.contributor.authorYen-Chien Laien_US
dc.contributor.authorOffice of International Affairsen_US
dc.date.accessioned2024-05-08T07:12:50Z-
dc.date.available2024-05-08T07:12:50Z-
dc.date.issued2024-03-28en_US
dc.identifier.urihttps://www.nycu.edu.tw/nycu/en/app/news/view?module=headnews&id=552&serno=da196878-cc17-410c-b885-843c19b07382en_US
dc.identifier.urihttp://hdl.handle.net/11536/162910-
dc.description.abstractNational Yang Ming Chiao Tung University (NYCU) conferred an In February, the Department of Industrial Engineering and Management (IEM) at National Yang Ming Chiao Tung University (NYCU) and the semiconductor giant United Microelectronics Corporation (UMC) conducted a signing ceremony for their industry-academia collaboration, declaring their joint development of a semiconductor cross-fab capacity planning optimization system.en_US
dc.language.isoen_USen_US
dc.publisher國立陽明交通大學zh_TW
dc.publisherNational Yang Ming Chiao Tung Universityen_US
dc.title【Spotlights】Supporting UMC's digital transformation NYCU develops a semiconductor capacity planning system to optimize production operations efficiencyen_US
dc.typeHistorical Newsen_US
dc.identifier.journal陽明交大英文電子報zh_TW
dc.identifier.journalNYCU E-NEWSen_US
dc.citation.issue2024-03en_US
顯示於類別:陽明交大英文電子報


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  1. 2024 Newsletter_March-05.pdf

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