Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 秘書處 | zh_TW |
| dc.date.accessioned | 2024-07-16T09:23:06Z | - |
| dc.date.available | 2024-07-16T09:23:06Z | - |
| dc.date.issued | 2024-07-15 | en_US |
| dc.identifier.uri | https://www.nycu.edu.tw/nycu/ch/app/news/view?module=headnews&id=2994&serno=aaede506-a830-45f4-b21a-f89b15befbcd | en_US |
| dc.identifier.uri | http://hdl.handle.net/11536/163047 | - |
| dc.description.abstract | 受邀前往日本半導體基地，提高當地大學研發能力，不僅是台日頂尖大學的互動，更是兩國在半導體產業合作的契機 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.publisher | 國立陽明交通大學 | zh_TW |
| dc.publisher | National Yang Ming Chiao Tung University | en_US |
| dc.title | 與日本大學簽訂合作備忘錄 | zh_TW |
| dc.type | Historical News | en_US |
| dc.identifier.journal | 陽明交大電子報 | zh_TW |
| dc.identifier.journal | NYCU E-NEWS | en_US |
| dc.citation.issue | 第075期 | en_US |
| Appears in Collections: | NYCU E-NEWS | |
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