統計資料
總造訪次數
| 檢視 | |
|---|---|
| A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application | 119 |
本月總瀏覽
| 六月 2025 | 七月 2025 | 八月 2025 | 九月 2025 | 十月 2025 | 十一月 2025 | 十二月 2025 | |
|---|---|---|---|---|---|---|---|
| A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application | 0 | 0 | 0 | 0 | 0 | 1 | 0 |
檔案下載
| 檢視 | |
|---|---|
| 000305085100005.pdf | 25 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 98 |
| 美國 | 13 |
| 比利時 | 3 |
| 愛爾蘭 | 1 |
| 日本 | 1 |
| 台灣 | 1 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 96 |
| Kensington | 5 |
| Menlo Park | 5 |
| Heverlee | 3 |
| Beijing | 2 |
| Edmond | 2 |
| Buffalo | 1 |
| Hsinchu | 1 |
| Tokyo | 1 |