完整後設資料紀錄
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dc.contributor.authorCheng, Hui-Wenen_US
dc.contributor.authorHwang, Chih-Hongen_US
dc.contributor.authorChao, Ko-Anen_US
dc.contributor.authorLi, Yimingen_US
dc.date.accessioned2014-12-08T15:23:44Z-
dc.date.available2014-12-08T15:23:44Z-
dc.date.issued2012-03-01en_US
dc.identifier.issn1533-4880en_US
dc.identifier.urihttp://hdl.handle.net/11536/16554-
dc.description.abstractComparison of two different implantation processing techniques for random dopant (RD)-induced threshold voltage fluctuation (sigma V-th) in 15-nm metal-oxide-semiconductor (MOS) devices is reported. Implantations of flash lamp annealing and laser spike annealing are simulated using a kinetic Monte Carlo (KMC) technique. The KMC generated distributions are mapped into device channel for three-dimensional quantum mechanical transport simulation to estimate threshold voltage fluctuation. The main results of this study show that the laser spike annealing could achieve 30% reduction of RDF-induced sigma V-th for low-power application of 15-nm MOS devices, compared with flash lamp annealing.en_US
dc.language.isoen_USen_US
dc.subjectRandom Dopant Fluctuationen_US
dc.subjectFlash Lamp Annealingen_US
dc.subjectLaser Spike Annealingen_US
dc.subjectKinetic Monte Carloen_US
dc.subjectDevice Simulationen_US
dc.titleEffect of Flash Lamp Annealing and Laser Spike Annealing on Random Dopant Fluctuation of 15-nm Metal-Oxide-Semiconductor Devicesen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGYen_US
dc.citation.volume12en_US
dc.citation.issue3en_US
dc.citation.epage2462en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000305039700101-
dc.citation.woscount0-
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