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dc.contributor.authorChen, Chung Weien_US
dc.contributor.authorRen, F.en_US
dc.contributor.authorChi, Gou-Chungen_US
dc.contributor.authorHung, S. C.en_US
dc.contributor.authorHuang, Y. P.en_US
dc.contributor.authorKim, Jihyunen_US
dc.contributor.authorKravchenko, Ivanen_US
dc.contributor.authorPearton, Stephen J.en_US
dc.date.accessioned2014-12-08T15:24:06Z-
dc.date.available2014-12-08T15:24:06Z-
dc.date.issued2012-07-01en_US
dc.identifier.issn1071-1023en_US
dc.identifier.urihttp://dx.doi.org/40602en_US
dc.identifier.urihttp://hdl.handle.net/11536/16761-
dc.description.abstract"Graphene layers on SiO2/Si substrates were exposed to chemicals or gases commonly used in semiconductor fabrication processes, including solvents (isopropanol, acetone), acids, bases (ammonium hydroxide), UV ozone, H2O, and O-2 plasmas. The recovery of the initial graphene properties after these exposures was monitored by measuring both the layer resistance and Raman 2D peak position as a function of time in air or vacuum. Solvents and UV ozone were found to have the least affect, while oxygen plasma exposure caused an increase of resistance of more than 3 orders of magnitude. Recovery is accelerated under vacuum but changes can persist for more than 5 h. Careful design of fabrication schemes involving graphene is necessary to minimize these interactions with common processing chemicals. (C) 2012 American Vacuum Society. [http://dx.doi.org/10.1116/1.4732517]"en_US
dc.language.isoen_USen_US
dc.titleEffects of semiconductor processing chemicals on conductivity of grapheneen_US
dc.typeArticleen_US
dc.identifier.doi40602en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ben_US
dc.citation.volume30en_US
dc.citation.issue4en_US
dc.citation.epageen_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000306750700013-
dc.citation.woscount1-
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