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dc.contributor.authorYeh, Chih-Tingen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2014-12-08T15:24:11Z-
dc.date.available2014-12-08T15:24:11Z-
dc.date.issued2012-10-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2012.2209120en_US
dc.identifier.urihttp://hdl.handle.net/11536/16813-
dc.description.abstractAn ultralow-leakage power-rail electrostatic discharge (ESD) clamp circuit realized with only thin gate oxide devices and with silicon-controlled rectifier (SCR) as the main ESD clamp device has been proposed and verified in a 65-nm CMOS process. By reducing the voltage difference across the gate oxide of the devices in the ESD detection circuit, the proposed power-rail ESD clamp circuit can achieve an ultralow standby leakage current. In addition, the ESD-transient detection circuit can be totally embedded in the SCR device bymodifying the layout structure. From the measured results, the proposed power-rail ESD clamp circuit with an SCR width of 45 mu m can achieve 7-kV human-body-model and 350-V machine-model ESD levels under the ESD stress event while consuming only a standby leakage current in the order of nanoamperes at room temperature under the normal circuit operating condition with 1-V bias.en_US
dc.language.isoen_USen_US
dc.subjectgate leakageen_US
dc.subjectpower-rail electrostatic discharge (ESD) clamp circuiten_US
dc.subjectsilicon-controlled rectifier (SCR)en_US
dc.titlePower-Rail ESD Clamp Circuit With Ultralow Standby Leakage Current and High Area Efficiency in Nanometer CMOS Technologyen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2012.2209120en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume59en_US
dc.citation.issue10en_US
dc.citation.spage2626en_US
dc.citation.epage2634en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000309132200009-
dc.citation.woscount3-
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