Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 國際事務處 | zh_TW |
| dc.contributor.author | Chance Lai;Office of International Affairs | en_US |
| dc.date.accessioned | 2026-03-04T02:43:35Z | - |
| dc.date.available | 2026-03-04T02:43:35Z | - |
| dc.date.issued | 2026-02-23 | en_US |
| dc.identifier.uri | https://www.nycu.edu.tw/nycu/en/app/news/view?module=headnews&id=552&serno=f193f1ac-b988-4b58-b87b-5cf0ce07c56f | en_US |
| dc.identifier.uri | http://hdl.handle.net/11536/168359 | - |
| dc.description.abstract | National Yang Ming Chiao Tung University (NYCU) and the University of Arizona (UA) have formally launched the Talent and Innovation Hub (TIH–NYCU–UA) following the signing of a memorandum of understanding on January 28, 2026. | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | 國立陽明交通大學 | zh_TW |
| dc.publisher | National Yang Ming Chiao Tung University | en_US |
| dc.title | 【Spotlight】NYCU and University of Arizona Launch Talent and Innovation Hub to Advance Semiconductor and AI Collaboration | en_US |
| dc.type | Historical News | en_US |
| dc.identifier.journal | 陽明交大英文電子報 | zh_TW |
| dc.identifier.journal | NYCU E-NEWS | en_US |
| dc.citation.issue | 2026-02 | en_US |
| Appears in Collections: | NYCU E-NEWS | |
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