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dc.contributor.authorYang, Po-Yuen_US
dc.contributor.authorWang, Jyh-Liangen_US
dc.contributor.authorTsai, Wei-Chihen_US
dc.contributor.authorChang, Yu-Chengen_US
dc.contributor.authorWang, Shui-Jinnen_US
dc.contributor.authorLee, I-Cheen_US
dc.contributor.authorWang, Chao-Lungen_US
dc.contributor.authorChien, Yun-Shanen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.date.accessioned2014-12-08T15:24:26Z-
dc.date.available2014-12-08T15:24:26Z-
dc.date.issued2012-07-01en_US
dc.identifier.issn1533-4880en_US
dc.identifier.urihttp://dx.doi.org/10.1166/jnn.2012.6309en_US
dc.identifier.urihttp://hdl.handle.net/11536/16952-
dc.description.abstractIn this paper, high-performance bottom-gate (BG) thin-film transistors (TFTs) with zinc oxide (ZnO) artificially location-controlled lateral grain growth have been prepared via low-temperature hydrothermal method. For the proper design of source/drain structure of ZnO/Ti/Pt thin films, the grains can be laterally grown from the under-cut ZnO beneath the Ti/Pt layer. Consequently, the single one vertical grain boundary perpendicular to the current flow will be produced in the channel region as the grown grains from the source/drain both sides are impinged. As compared with the conventional sputtered ZnO BG-TFTs, the proposed location-controlled hydrothermal ZnO BG-TFTs (W/L = 250 mu m/10 mu m) demonstrated the higher field-effect mobility of 6.09 cm(2)/V.s, lower threshold voltage of 3.67 V, higher on/off current ratio above 10(6), and superior current drivability, reflecting the high-quality ZnO thin films with less grain boundary effect in the channel region.en_US
dc.language.isoen_USen_US
dc.subjectZinc Oxide (ZnO)en_US
dc.subjectHydrothermal Methoden_US
dc.subjectThin-Film Transistor (TFT)en_US
dc.titleHigh-Performance ZnO Thin-Film Transistors with Location-Controlled Crystal Grains Fabricated by Low-Temperature Hydrothermal Methoden_US
dc.typeArticleen_US
dc.identifier.doi10.1166/jnn.2012.6309en_US
dc.identifier.journalJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGYen_US
dc.citation.volume12en_US
dc.citation.issue7en_US
dc.citation.spage5783en_US
dc.citation.epage5787en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000307604700123-
dc.citation.woscount5-
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