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dc.contributor.authorHsu, Hsiao-Hsuanen_US
dc.contributor.authorCheng, Chun-Huen_US
dc.contributor.authorTsui, Bing-Yueen_US
dc.date.accessioned2014-12-08T15:24:27Z-
dc.date.available2014-12-08T15:24:27Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-2784-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/16965-
dc.description.abstractHafnium titanate (HfTiO) film was adapted as the insulator of MIM capacitors for RF/Analog ICs applications. Low leakage current of 3.4x10(-8) A/cm(2) at -IV and high capacitance density of 17.5fF/mu m(2) were obtained. A N(2)-plasma treatment on HfTiO films can further reduce leakage current by two orders of magnitude and no apparent degradation is observed on the capacitance density and voltage coefficient of capacitance (VCC) properties. Capacitance density of 5.1fF/mu m(2), leakage current of 1.3x10(-9)A/cm(2), and parabolic VCC value of 40ppm/V(2) can be achieved by 51nm thick HfTiO film. These results meet the RF/analog requirements in 2012 predicted by ITRS.en_US
dc.language.isoen_USen_US
dc.titleHigh Performance Metal/Insulator/Metal Capacitors Using HfTiO as Dielectricen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF TECHNICAL PROGRAM: 2009 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATIONSen_US
dc.citation.spage67en_US
dc.citation.epage68en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000272451000029-
Appears in Collections:Conferences Paper