完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lo, Ming-Hua | en_US |
dc.contributor.author | Tu, Po-Min | en_US |
dc.contributor.author | Cheng, Yuh-Jen | en_US |
dc.contributor.author | Wang, Chao-Hsun | en_US |
dc.contributor.author | Hung, Cheng-Wei | en_US |
dc.contributor.author | Hsu, Shih-Chieh | en_US |
dc.contributor.author | Kuo, Hao-Chung | en_US |
dc.contributor.author | Zan, Hsiao-Wen | en_US |
dc.contributor.author | Wang, Shing-Chung | en_US |
dc.contributor.author | Chang, Chun-Yen | en_US |
dc.contributor.author | Liu, Che-Ming | en_US |
dc.date.accessioned | 2014-12-08T15:24:28Z | - |
dc.date.available | 2014-12-08T15:24:28Z | - |
dc.date.issued | 2010 | en_US |
dc.identifier.isbn | 978-0-8194-7998-3 | en_US |
dc.identifier.issn | 0277-786X | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/16976 | - |
dc.description.abstract | We demonstrate high efficiency blue light emitting diodes with defect passivation layers. The defect passivation layers were formed by defect selective wet etching, SiO(2) deposition, and chemical mechanical polishing process. The process does not require photolithography patterning. The threading dislocation density of grown sample was reduced down to similar to 4x10(7) cm(-2). The defect passivated epi-wafer is used to grow light emitting diode (LED) and the output power of the fabricated chip is enhanced by 45% at 20 mA compared to a reference one without using defect passivation. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | GaN | en_US |
dc.subject | defect passivation | en_US |
dc.title | Output Power Enhancement of Light Emitting Diodes with Defect Passivation layer | en_US |
dc.type | Article | en_US |
dc.identifier.journal | GALLIUM NITRIDE MATERIALS AND DEVICES V | en_US |
dc.citation.volume | 7602 | en_US |
dc.contributor.department | 光電工程學系 | zh_TW |
dc.contributor.department | Department of Photonics | en_US |
dc.identifier.wosnumber | WOS:000285576300039 | - |
顯示於類別: | 會議論文 |