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dc.contributor.authorLo, Ming-Huaen_US
dc.contributor.authorTu, Po-Minen_US
dc.contributor.authorCheng, Yuh-Jenen_US
dc.contributor.authorWang, Chao-Hsunen_US
dc.contributor.authorHung, Cheng-Weien_US
dc.contributor.authorHsu, Shih-Chiehen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.contributor.authorZan, Hsiao-Wenen_US
dc.contributor.authorWang, Shing-Chungen_US
dc.contributor.authorChang, Chun-Yenen_US
dc.contributor.authorLiu, Che-Mingen_US
dc.date.accessioned2014-12-08T15:24:28Z-
dc.date.available2014-12-08T15:24:28Z-
dc.date.issued2010en_US
dc.identifier.isbn978-0-8194-7998-3en_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/16976-
dc.description.abstractWe demonstrate high efficiency blue light emitting diodes with defect passivation layers. The defect passivation layers were formed by defect selective wet etching, SiO(2) deposition, and chemical mechanical polishing process. The process does not require photolithography patterning. The threading dislocation density of grown sample was reduced down to similar to 4x10(7) cm(-2). The defect passivated epi-wafer is used to grow light emitting diode (LED) and the output power of the fabricated chip is enhanced by 45% at 20 mA compared to a reference one without using defect passivation.en_US
dc.language.isoen_USen_US
dc.subjectGaNen_US
dc.subjectdefect passivationen_US
dc.titleOutput Power Enhancement of Light Emitting Diodes with Defect Passivation layeren_US
dc.typeArticleen_US
dc.identifier.journalGALLIUM NITRIDE MATERIALS AND DEVICES Ven_US
dc.citation.volume7602en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000285576300039-
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