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dc.contributor.authorYeh, Kuo-Liangen_US
dc.contributor.authorKu, Chih-Youen_US
dc.contributor.authorHong, Wei-Lunen_US
dc.contributor.authorGuo, Jyh-Chyurnen_US
dc.date.accessioned2014-12-08T15:24:43Z-
dc.date.available2014-12-08T15:24:43Z-
dc.date.issued2009en_US
dc.identifier.isbn978-1-4244-3377-3en_US
dc.identifier.issn1529-2517en_US
dc.identifier.urihttp://hdl.handle.net/11536/17162-
dc.description.abstractThe uni-axial compressive strain from e-SiGe S/D combined with dynamic body biases effect on flicker noise of pMOSFETs is presented in this paper. This compressive strain contributes higher mobility but the worse flicker noise in terms of higher S(ID)/I(D)(2) becomes a potential killer to RF/analog circuits. Forward body biases (FBB) can reduce the flicker noise but the degraded body bias effect in strained pMOSFETs makes it not as efficient as the standard ones without strain. Hooge's mobility fluctuation model is adopted to explain the uni-axial strain and dynamic body biases effect on flicker noise. The increase of Hooge parameter alpha(H) is identified the key factor responsible the degraded flicker noise in strained pMOSFETs.en_US
dc.language.isoen_USen_US
dc.subjectFlicker noiseen_US
dc.subjectbody biasen_US
dc.subjectstrainen_US
dc.subjectmobilityen_US
dc.subjectpMOSFETen_US
dc.titleFlicker Noise in Nanoscale pMOSFETs with Mobility Enhancement Engineering and Dynamic Body Biasesen_US
dc.typeProceedings Paperen_US
dc.identifier.journalRFIC: 2009 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUMen_US
dc.citation.spage311en_US
dc.citation.epage314en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000274346000080-
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