完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lin, YH | en_US |
dc.contributor.author | Chien, CH | en_US |
dc.contributor.author | Chou, TH | en_US |
dc.contributor.author | Chao, TS | en_US |
dc.contributor.author | Chang, CY | en_US |
dc.contributor.author | Lei, TF | en_US |
dc.date.accessioned | 2014-12-08T15:25:12Z | - |
dc.date.available | 2014-12-08T15:25:12Z | - |
dc.date.issued | 2005 | en_US |
dc.identifier.isbn | 0-7803-9268-X | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/17584 | - |
dc.description.abstract | In this paper, we, for the first time, have successfully fabricated SONOS-type poly-Si-TFT memories employing three kinds of high-k dielectrics, including HfO(2), Hf-silicate and Zr-silicate, as the trapping layer with low-thermal budget processing. It was demonstrated that the fabricated memories exhibit good performance in terms of relatively large memory window, high program/erase speed (1ms/10ms), long retention time (> 10(6)S for 20% charge loss) and negligible read/write disturbances. In particular, 2-bit operation has been successfully demonstrated. | en_US |
dc.language.iso | en_US | en_US |
dc.title | 2-bit poly-Si-TFT nonvolatile memory using hafnium oxide, hafnium silicate and zirconium silicate | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST | en_US |
dc.citation.spage | 949 | en_US |
dc.citation.epage | 952 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000236225100217 | - |
顯示於類別: | 會議論文 |