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dc.contributor.authorLai, CHen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorChiang, KCen_US
dc.contributor.authorYoo, WJen_US
dc.contributor.authorCheng, CFen_US
dc.contributor.authorMcAlister, SPen_US
dc.contributor.authorChi, CCen_US
dc.contributor.authorWu, Pen_US
dc.date.accessioned2014-12-08T15:25:27Z-
dc.date.available2014-12-08T15:25:27Z-
dc.date.issued2005en_US
dc.identifier.isbn4-900784-00-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/17838-
dc.description.abstractUsing the strong trapping capability of novel AlN (kappa=10), low voltage drop in high-kappa layers and high workfunction IrO2 with low leakage current, the SiO2/AlN/HfAlO(K=17)/IrO2 device shows good 85 degrees C memory integrity of fast 100 is erase, large 3.7V Delta V-th and 1.9V extrapolated memory window for 10-year retention at low 13V program/erase. These increase to 5.5V Delta V-th and 3.4V for 85 degrees C 10-year retention at 1 ms erase.en_US
dc.language.isoen_USen_US
dc.titleNovel SiO2/AlN/HfAlO/IrO2 memory with fast erase, large triangle V-th and good retentionen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2005 Symposium on VLSI Technology, Digest of Technical Papersen_US
dc.citation.spage210en_US
dc.citation.epage211en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000234973100082-
Appears in Collections:Conferences Paper