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dc.contributor.authorChang, Chi-Yangen_US
dc.contributor.authorLiao, Ching-Kuen_US
dc.contributor.authorNiu, Dow-Chihen_US
dc.date.accessioned2014-12-08T15:25:27Z-
dc.date.available2014-12-08T15:25:27Z-
dc.date.issued2005en_US
dc.identifier.isbn2-9600551-2-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/17840-
dc.description.abstractA MMIC ultra-broadband star mixer using Mouw's hybrid junction is presented in this paper. The MMIC chip uses 0.15 mu m HEMT process. The chip is measured in three mounting environments, namely, absorber backed, 15 mil Al(2)O(3) substrate plus absorber, and conductor backed and all of them show ultra-broadband performances. The measured results show that the bandwidth is from 1.5 to 37 GHz except a resonant dip near. 23 GHz occurs in conductor backed case.. The IF 3 dB bandwidth is from DC to 2.5 GHz. The chip can be used as either up- or down-converter. Because the spiral layout of the Mouw's hybrid junction shrinks the area significantly, no off chip baluns are required. The chip size is 2 mm by 2 mm.en_US
dc.language.isoen_USen_US
dc.titleA 1.5 to 37 GHz ultra-broadband MMIC Mouw's star mixeren_US
dc.typeProceedings Paperen_US
dc.identifier.journal35TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGSen_US
dc.citation.spage987en_US
dc.citation.epage990en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000238143301073-
Appears in Collections:Conferences Paper