完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Chang, Chi-Yang | en_US |
dc.contributor.author | Liao, Ching-Ku | en_US |
dc.contributor.author | Niu, Dow-Chih | en_US |
dc.date.accessioned | 2014-12-08T15:25:27Z | - |
dc.date.available | 2014-12-08T15:25:27Z | - |
dc.date.issued | 2005 | en_US |
dc.identifier.isbn | 2-9600551-2-8 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/17840 | - |
dc.description.abstract | A MMIC ultra-broadband star mixer using Mouw's hybrid junction is presented in this paper. The MMIC chip uses 0.15 mu m HEMT process. The chip is measured in three mounting environments, namely, absorber backed, 15 mil Al(2)O(3) substrate plus absorber, and conductor backed and all of them show ultra-broadband performances. The measured results show that the bandwidth is from 1.5 to 37 GHz except a resonant dip near. 23 GHz occurs in conductor backed case.. The IF 3 dB bandwidth is from DC to 2.5 GHz. The chip can be used as either up- or down-converter. Because the spiral layout of the Mouw's hybrid junction shrinks the area significantly, no off chip baluns are required. The chip size is 2 mm by 2 mm. | en_US |
dc.language.iso | en_US | en_US |
dc.title | A 1.5 to 37 GHz ultra-broadband MMIC Mouw's star mixer | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 35TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS | en_US |
dc.citation.spage | 987 | en_US |
dc.citation.epage | 990 | en_US |
dc.contributor.department | 電信工程研究所 | zh_TW |
dc.contributor.department | Institute of Communications Engineering | en_US |
dc.identifier.wosnumber | WOS:000238143301073 | - |
顯示於類別: | 會議論文 |