標題: Electromigration in eutectic SnPb solder bumps with Ni/Cu UBM
作者: Chiu, SH
Liang, SW
Chen, C
Lin, SS
Chou, CM
Liu, YC
Chen, KH
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 2005
摘要: This study investigates the electromigration behavior of eutectic SnPb solder bumps with Ni/Cu UBM, in which the thickness of the Ni and Cu layer is 3 pm and 5 pm, respectively. It was found that the SnPb solderjoints have better electromigration resistance than that of SnAg bumps with thin film UBM. The thermal characteristic of SnPb solder joints under current stressing was measured by infrared technique. The Joule heating effect was less serious due to the wide Al trace of 100 mu m. Besides, a three-dimensional simulation on current density distribution was performed to examine the current crowding behavior in the joint. The results show that the current crowding occurs at the entrance point of the Al trace, which caused higher formation rate of intermetallic compounds there, and thus open failure occurred.
URI: http://hdl.handle.net/11536/17979
ISBN: 0-7803-9085-7
期刊: 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
起始頁: 63
結束頁: 65
Appears in Collections:Conferences Paper