The weldability study of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packages

Title:	The weldability study of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packages
Authors:	Lin, CT Chiou, BS Wang, SC Chi, S 光電工程學系 Department of Photonics
Issue Date:	2005
Abstract:	Metal parts fabricated by Metal injection molding for optoelectronic packages provides good weldability, shape complexity, low cost, and long-term reliability. The coupling loss due to post welding shift is < 0.4dB.
URI:	http://hdl.handle.net/11536/18021
ISBN:	0-7803-9217-5
ISSN:	1092-8081
Journal:	2005 IEEE LEOS Annual Meeting Conference Proceedings (LEOS)
Begin Page:	506
End Page:	507
Appears in Collections:	Conferences Paper

APA	Lin, C., Chiou, B., Wang, S., & Chi, S. (2005). The weldability study of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packages. WOS:000235109700256.
Bibtex	@article{Lin2005The, title={The weldability study of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packages}, author={Lin, CT and Chiou, BS and Wang, SC and Chi, S}, journal={WOS:000235109700256}, year={2005}, url={https://ir.lib.nycu.edu.tw/handle/11536/18021}, }