The feasibility of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packaging

Title:	The feasibility of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packaging
Authors:	Lin, CT Chiou, BS Chi, S 交大名義發表 National Chiao Tung University
Issue Date:	2005
Abstract:	The laser weldability of metal injection molding stainless steel 316L with 97% full density and powder metallurgical stainless steel with 85% full density is investigated.
URI:	http://hdl.handle.net/11536/18070
ISBN:	0-7803-9242-6
Journal:	2005 Pacific Rim Conference on Lasers and Electro-Optics
Begin Page:	473
End Page:	474
Appears in Collections:	Conferences Paper

APA	Lin, C., Chiou, B., & Chi, S. (2005). The feasibility of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packaging. WOS:000236757900227.
Bibtex	@article{Lin2005The, title={The feasibility of stainless steel fabricated by metal injection molding and powder metallurgy for optoelectronic packaging}, author={Lin, CT and Chiou, BS and Chi, S}, journal={WOS:000236757900227}, year={2005}, url={https://ir.lib.nycu.edu.tw/handle/11536/18070}, }