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dc.contributor.authorHuang, CFen_US
dc.contributor.authorTsui, BYen_US
dc.date.accessioned2014-12-08T15:25:45Z-
dc.date.available2014-12-08T15:25:45Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7803-8166-1en_US
dc.identifier.issn2159-1660en_US
dc.identifier.urihttp://hdl.handle.net/11536/18186-
dc.description.abstractIt has been reported that the work function of Ta-Pt alloys is tunable and Ta-Pt is a possible gate material for CMOS devices. In this work, we demonstrate that the Ta-Pt alloy is thermally stable up to 900degreesC. The impact of oxygen contamination and thermal stress on the stability of the MOS structure with the alloy gate is also discussed. It is concluded that the Ta-Pt alloy is a good candidate for gate electrode in the nanoscale CMOS regime and is compatible with the conventional self-aligned process.en_US
dc.language.isoen_USen_US
dc.titleHigh thermal stability metal gate with tunable work functionen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2en_US
dc.citation.spage451en_US
dc.citation.epage454en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000222219300091-
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