完整後設資料紀錄
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dc.contributor.authorTsai, LNen_US
dc.contributor.authorShen, GRen_US
dc.contributor.authorCheng, YTen_US
dc.contributor.authorHsu, Wen_US
dc.date.accessioned2014-12-08T15:25:48Z-
dc.date.available2014-12-08T15:25:48Z-
dc.date.issued2004en_US
dc.identifier.isbn0-7803-8365-6en_US
dc.identifier.issn0569-5503en_US
dc.identifier.urihttp://hdl.handle.net/11536/18234-
dc.description.abstractHere a low-temperature stress-free electrolytic nickel (EL) deposition process with the addition of uniformly dispersed diamond nanoparticles (diameter < 0.5 mum) is propose to fabricate cantilevers and electro-thermal microactuators to demonstrate the improvement of the device on reducing input power requirement and enhancing operation reliability. The fabrication results show that the nanodiamond particles are successfully dispersed in the electroplating nickel layers. By calibrating the resonant frequencies of nickel cantilevers with different concentrations of diamond nanoparticles, the E/pratio of cantilevers can be enhanced 7.1 times with diamond nanoparticles of 2 g/l in the proposed electrolytic nickel (EL) deposition process. From displacement tests, the electro-thermal microactuator with nanodiamond particles of 2 g/l reduces 73% power requirement of pure nickel device needed at the same output displacement of 3 mum. Also, the reversible displacement range is found to be expanded from 1.8 mum to 3 mum by adding nanodiamond particles of 2 g/l in the nickel electro-thermal microactuators.en_US
dc.language.isoen_USen_US
dc.titlePower and reliability improvement of an electro-thermal microactuator using Ni-diamond nanocompositeen_US
dc.typeProceedings Paperen_US
dc.identifier.journal54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGSen_US
dc.citation.spage472en_US
dc.citation.epage476en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000224340900074-
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