Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lin, YC | en_US |
dc.contributor.author | Chiou, JC | en_US |
dc.date.accessioned | 2014-12-08T15:26:06Z | - |
dc.date.available | 2014-12-08T15:26:06Z | - |
dc.date.issued | 2003 | en_US |
dc.identifier.isbn | 0-8194-4976-8 | en_US |
dc.identifier.issn | 0277-786X | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/18498 | - |
dc.identifier.uri | http://dx.doi.org/10.1117/12.498870 | en_US |
dc.description.abstract | In this paper, a back-to-back micromirror device fabricated through surface-micromachining and flip chip packaging technologies is developed for optical add/drop multiplexer applications. Pre-stressed beams were designed to elevate micromirror devices after the release and thermal heat-treatment processes. Torsion flexure structure design provides a reliable rotation degree of freedom for micromirror devices. A mechanical stopper was bonded using flip chip packaging on the top of micromirror devices to constrain the popped-up micromirror to obtain precise deflecting angle. Preliminary experiments had demonstrated the feasibility of the micromirror devices. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | back-to-back | en_US |
dc.subject | micromirror | en_US |
dc.subject | pre-stressed | en_US |
dc.subject | heat-treatment | en_US |
dc.title | A back-to-back micromirror device for optical add/drop multiplexer applications | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.doi | 10.1117/12.498870 | en_US |
dc.identifier.journal | SMART SENSORS, ACTUATORS, AND MEMS, PTS 1 AND 2 | en_US |
dc.citation.volume | 5116 | en_US |
dc.citation.spage | 473 | en_US |
dc.citation.epage | 479 | en_US |
dc.contributor.department | 電控工程研究所 | zh_TW |
dc.contributor.department | Institute of Electrical and Control Engineering | en_US |
dc.identifier.wosnumber | WOS:000184053200053 | - |
Appears in Collections: | Conferences Paper |
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