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dc.contributor.authorGuo, JCen_US
dc.contributor.authorHuang, CHen_US
dc.contributor.authorChan, KTen_US
dc.contributor.authorLien, WYen_US
dc.contributor.authorWu, CMen_US
dc.contributor.authorSun, YCen_US
dc.date.accessioned2014-12-08T15:26:10Z-
dc.date.available2014-12-08T15:26:10Z-
dc.date.issued2003en_US
dc.identifier.isbn1-58053-834-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/18561-
dc.identifier.urihttp://dx.doi.org/10.1109/EUMC.2003.177569en_US
dc.description.abstractSuperior RF CMOS of 115GHz f(T) and 80GHz f(max) has been realized by 0.13mum low voltage logic based RF CMOS technology by aggressive device scaling and optimized layout. NFmin of 2.2dB at 10GHz is achieved even without deep N-well and ground-shielded signal pad. P,dB of near 10dBm can fit bluetooth requirement and 55% PAE at 2.4 GHz address the good potential of sub-100nm CMOS for low voltage RF power applications.en_US
dc.language.isoen_USen_US
dc.title0.13 mu m low voltage logic based RF CMOS technology with 115GHz f(T) and 80GHz f(MAX)en_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/EUMC.2003.177569en_US
dc.identifier.journal33RD EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGSen_US
dc.citation.spage683en_US
dc.citation.epage686en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000189197200170-
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