完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Guo, JC | en_US |
dc.contributor.author | Huang, CH | en_US |
dc.contributor.author | Chan, KT | en_US |
dc.contributor.author | Lien, WY | en_US |
dc.contributor.author | Wu, CM | en_US |
dc.contributor.author | Sun, YC | en_US |
dc.date.accessioned | 2014-12-08T15:26:10Z | - |
dc.date.available | 2014-12-08T15:26:10Z | - |
dc.date.issued | 2003 | en_US |
dc.identifier.isbn | 1-58053-834-7 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/18561 | - |
dc.identifier.uri | http://dx.doi.org/10.1109/EUMC.2003.177569 | en_US |
dc.description.abstract | Superior RF CMOS of 115GHz f(T) and 80GHz f(max) has been realized by 0.13mum low voltage logic based RF CMOS technology by aggressive device scaling and optimized layout. NFmin of 2.2dB at 10GHz is achieved even without deep N-well and ground-shielded signal pad. P,dB of near 10dBm can fit bluetooth requirement and 55% PAE at 2.4 GHz address the good potential of sub-100nm CMOS for low voltage RF power applications. | en_US |
dc.language.iso | en_US | en_US |
dc.title | 0.13 mu m low voltage logic based RF CMOS technology with 115GHz f(T) and 80GHz f(MAX) | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.doi | 10.1109/EUMC.2003.177569 | en_US |
dc.identifier.journal | 33RD EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS | en_US |
dc.citation.spage | 683 | en_US |
dc.citation.epage | 686 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000189197200170 | - |
顯示於類別: | 會議論文 |