統計資料
總造訪次數
| 檢視 | |
|---|---|
| Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology | 105 |
本月總瀏覽
檔案下載
| 檢視 | |
|---|---|
| 000182081100048.pdf | 3 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 98 |
| 美國 | 6 |
| 台灣 | 1 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 97 |
| Kensington | 3 |
| Menlo Park | 3 |
| Beijing | 1 |
| Taipei | 1 |
| 檢視 | |
|---|---|
| Electromigration induced failure in SnAg3.8Cu0.7 solder joints for flip chip technology | 105 |
| 檢視 | |
|---|---|
| 000182081100048.pdf | 3 |
| 檢視 | |
|---|---|
| 中國 | 98 |
| 美國 | 6 |
| 台灣 | 1 |
| 檢視 | |
|---|---|
| Shenzhen | 97 |
| Kensington | 3 |
| Menlo Park | 3 |
| Beijing | 1 |
| Taipei | 1 |