完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.author | Sheen, CS | en_US |
| dc.contributor.author | Chi, S | en_US |
| dc.date.accessioned | 2014-12-08T15:26:57Z | - |
| dc.date.available | 2014-12-08T15:26:57Z | - |
| dc.date.issued | 2000 | en_US |
| dc.identifier.isbn | 0-7803-5890-2 | en_US |
| dc.identifier.issn | 1091-5281 | en_US |
| dc.identifier.uri | http://hdl.handle.net/11536/19185 | - |
| dc.description.abstract | Sensing using multi-chip package for optical sensing device enjoys the benefits of both optics and integrated circuits. By including the advent of MEMS technologies it can potentially lead to a new generation of miniaturized optical sensing devices and system. We propose and fabricate a miniaturized radiation-sensing module, which transfer the output analog signal to a light signal and it can be easily delivered through a single mode fiber. It consists of an infrared sensing thermopile, an ASIC chip and a LED, which acts as an electric-optical signal transfer component. Details of these components design, fabrications, experimental results are presented in this paper. | en_US |
| dc.language.iso | en_US | en_US |
| dc.title | A new fiber-communication miniature sensor module | en_US |
| dc.type | Proceedings Paper | en_US |
| dc.identifier.journal | IMTC/2000: PROCEEDINGS OF THE 17TH IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE: SMART CONNECTIVITY: INTEGRATING MEASUREMENT AND CONTROL | en_US |
| dc.citation.spage | 350 | en_US |
| dc.citation.epage | 353 | en_US |
| dc.contributor.department | 光電工程學系 | zh_TW |
| dc.contributor.department | Department of Photonics | en_US |
| dc.identifier.wosnumber | WOS:000088408100067 | - |
| 顯示於類別: | 會議論文 | |

