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dc.contributor.authorSheen, CSen_US
dc.contributor.authorChi, Sen_US
dc.date.accessioned2014-12-08T15:26:57Z-
dc.date.available2014-12-08T15:26:57Z-
dc.date.issued2000en_US
dc.identifier.isbn0-7803-5890-2en_US
dc.identifier.issn1091-5281en_US
dc.identifier.urihttp://hdl.handle.net/11536/19185-
dc.description.abstractSensing using multi-chip package for optical sensing device enjoys the benefits of both optics and integrated circuits. By including the advent of MEMS technologies it can potentially lead to a new generation of miniaturized optical sensing devices and system. We propose and fabricate a miniaturized radiation-sensing module, which transfer the output analog signal to a light signal and it can be easily delivered through a single mode fiber. It consists of an infrared sensing thermopile, an ASIC chip and a LED, which acts as an electric-optical signal transfer component. Details of these components design, fabrications, experimental results are presented in this paper.en_US
dc.language.isoen_USen_US
dc.titleA new fiber-communication miniature sensor moduleen_US
dc.typeProceedings Paperen_US
dc.identifier.journalIMTC/2000: PROCEEDINGS OF THE 17TH IEEE INSTRUMENTATION AND MEASUREMENT TECHNOLOGY CONFERENCE: SMART CONNECTIVITY: INTEGRATING MEASUREMENT AND CONTROLen_US
dc.citation.spage350en_US
dc.citation.epage353en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000088408100067-
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