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dc.contributor.authorKu, CYen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorShieh, JMen_US
dc.contributor.authorChiou, TBen_US
dc.contributor.authorLin, HKen_US
dc.date.accessioned2014-12-08T15:27:01Z-
dc.date.available2014-12-08T15:27:01Z-
dc.date.issued2000en_US
dc.identifier.isbn0-8194-3843-Xen_US
dc.identifier.issn0277-786Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/19236-
dc.identifier.urihttp://dx.doi.org/10.1117/12.410087en_US
dc.description.abstractThe reduced depth of focus (DOF) caused by higher numerical aperture (NA) is making the accuracy of best focus measurement increasingly important. A new overlay pattern is developed herein to precisely measure the best focus of lithographic tools. Specially designed "bar-in-bar" (BIB) was employed to obtain the best focus by using the opposite shifting direction of inner and outer bars when defocused. The inner and outer bars are composed of various pattern sizes. When defocused, the shrinkage of the smaller patterns is more significant than that of the larger patterns, thus causing the center of gravity to shift. The distribution and pattern sizes are optimized to obtain high reproducibility and sensitive position shifting for various defocus conditions. Employing the special BIB pattern, the best focus, tilting and field curvature can be easily measured via the conventional overlay measurement tool. By adding the special BIB to the scribe lanes of the production wafers, the best focus and tilting of the stepper can be obtained when measuring a layer-to-layer overlay shift, and can then be fed back to the stepper as a reference for following processing wafers.en_US
dc.language.isoen_USen_US
dc.subjectreal-time process controlen_US
dc.subjectbar-in-bar (BIB)en_US
dc.subjectfocusen_US
dc.subjecttilten_US
dc.titleNew overlay pattern design for real-time focus and tilt monitoren_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1117/12.410087en_US
dc.identifier.journalPROCESS CONTROL AND DIAGNOSTICSen_US
dc.citation.volume4182en_US
dc.citation.spage268en_US
dc.citation.epage275en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000166978300031-
Appears in Collections:Conferences Paper


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