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dc.contributor.authorJiang, Meng-Danen_US
dc.contributor.authorLee, Pei-Yuen_US
dc.contributor.authorChiu, Tien-Lungen_US
dc.contributor.authorLin, Hong-Cheuen_US
dc.contributor.authorLee, Jiun-Hawen_US
dc.date.accessioned2014-12-08T15:27:08Z-
dc.date.available2014-12-08T15:27:08Z-
dc.date.issued2011-09-01en_US
dc.identifier.issn0379-6779en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.synthmet.2011.06.010en_US
dc.identifier.urihttp://hdl.handle.net/11536/19381-
dc.description.abstractThis investigation discusses the performance of an organic light-emitting device (OLED) with ultraviolet (UV) illuminated and remote pulsed Ar plasma (RPAP), treated copper phthalcyanine (CuPc) thin film on an indium tin oxide anode as the hole-blocking layer. UV treatment increased the driving voltage, the current efficiency decreased at the same time due to the poor sticking probability of NPB on the CuPc surface. By contrast, the driving voltage reduction and current efficiency enhancement were achieved at the same time for the OLED with the RPAP treated CuPc. Besides this, in such device, the thickness of CuPc affects seldom the current density-voltage-luminance characteristics. The surface characteristics of these processed CuPc thin films were investigated by using atomic force microscope, contact angle and X-ray photoelectron spectroscopy measurements, which showed the CuPc/, N,N'-bis-(1-naphthyl)-N,N'-dipheny1-1,1'-bipheny1-4,4'-diamine (NPB) interface was crucial to not only the interface energy barrier, but also the following NPB growth, mode. (C) 2011 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectOrganic light-emitting deviceen_US
dc.subjectRemote pulsed Ar plasmaen_US
dc.subjectHole-blockingen_US
dc.subjectLayeren_US
dc.titleOptimizing hole-injection in organic electroluminescent devices by modifying CuPc/NPB interfaceen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.synthmet.2011.06.010en_US
dc.identifier.journalSYNTHETIC METALSen_US
dc.citation.volume161en_US
dc.citation.issue17-18en_US
dc.citation.spage1828en_US
dc.citation.epage1831en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000295564000007-
dc.citation.woscount5-
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