標題: | SHIELDING EFFECT OF A DIAPHRAGM IN A PACKAGED MICROSTRIP CIRCUIT |
作者: | CHEN, HH CHUNG, SJ 交大名義發表 電信工程研究所 National Chiao Tung University Institute of Communications Engineering |
公開日期: | 1-五月-1995 |
摘要: | The scattering of a diaphragm in a packaged microstrip line is investigated using the mode-matching method together with the method of lines. Instead of analyzing the discontinuity in the microstrip, this paper tackles the variation of the waveguide housing, The influences of the thickness and the depth of the diaphragm on the scatterings of the dominant mode and higher-order modes are analyzed based on a comparison of the modal power distributions, Finally, the shielding effect of a pair of closely spaced diaphragms is investigated. |
URI: | http://dx.doi.org/10.1109/22.382069 http://hdl.handle.net/11536/1959 |
ISSN: | 0018-9480 |
DOI: | 10.1109/22.382069 |
期刊: | IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES |
Volume: | 43 |
Issue: | 5 |
起始頁: | 1082 |
結束頁: | 1086 |
顯示於類別: | 期刊論文 |