完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Sun, SC | en_US |
dc.contributor.author | Tsai, MH | en_US |
dc.contributor.author | Chiu, HT | en_US |
dc.contributor.author | Chuang, SH | en_US |
dc.contributor.author | Tsai, CE | en_US |
dc.date.accessioned | 2014-12-08T15:27:43Z | - |
dc.date.available | 2014-12-08T15:27:43Z | - |
dc.date.issued | 1995 | en_US |
dc.identifier.isbn | 0-7803-2700-4 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/19961 | - |
dc.language.iso | en_US | en_US |
dc.title | A comparative study of CVD TiN and CVD TaN diffusion barriers for copper interconnection | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST | en_US |
dc.citation.spage | 461 | en_US |
dc.citation.epage | 464 | en_US |
dc.contributor.department | 奈米中心 | zh_TW |
dc.contributor.department | Nano Facility Center | en_US |
dc.identifier.wosnumber | WOS:A1995BF10D00103 | - |
顯示於類別: | 會議論文 |