LIQUID-PHASE BONDING OF YTTRIA-STABILIZED ZIRCONIA WITH CAO-TIO2-SIO2 GLASS

doi:10.1007/BF00356134

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DC Field	Value	Language
dc.contributor.author	CHIOU, BS	en_US
dc.contributor.author	YOUNG, CD	en_US
dc.contributor.author	DUH, JG	en_US
dc.date.accessioned	2014-12-08T15:03:30Z	-
dc.date.available	2014-12-08T15:03:30Z	-
dc.date.issued	1995-03-01	en_US
dc.identifier.issn	0022-2461	en_US
dc.identifier.uri	http://dx.doi.org/10.1007/BF00356134	en_US
dc.identifier.uri	http://hdl.handle.net/11536/2034	-
dc.description.abstract	A 36.8wt % CaO-26.2 wt % TiO2-37.0 wt % SiO2 glass (CTS) was employed as the ceramic brazer for the bonding of 3 mol % yttria stabilized zirconia (YSZ3). Sandwich-like YSZ3-CTS-YSZ3 specimens were fabricated and temperature dependence of the bonding strength was evaluated. An optimum bonding process was achieved at a bonding temperature of 1424 degrees C for 30 min with CTS glass slurry having a glass/organic ratio of 1.82. The effects of processing parameters on the bending was investigated on the basis of the metallurgical evolution at the interface. In addition, predominating factors affecting the bonding strength were also explored.	en_US
dc.language.iso	en_US	en_US
dc.title	LIQUID-PHASE BONDING OF YTTRIA-STABILIZED ZIRCONIA WITH CAO-TIO2-SIO2 GLASS	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1007/BF00356134	en_US
dc.identifier.journal	JOURNAL OF MATERIALS SCIENCE	en_US
dc.citation.volume	30	en_US
dc.citation.issue	5	en_US
dc.citation.spage	1295	en_US
dc.citation.epage	1301	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:A1995QL40000025	-
dc.citation.woscount	2	-
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