標題: Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding
作者: Chen, K. N.
Cheng, C. A.
Huang, W. C.
Ko, C. T.
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Wafer Bonding;SU-8;Hybrid Bonding;Adhesive Bonding
公開日期: 1-Aug-2011
摘要: Bonding temperature optimization of SU-8 material for metal/adhesive hybrid bonding was investigated. The good bond quality of SU-8 adhesive can be achieved with the bonding temperature between 150 degrees C and 250 degrees C, while bond failures of SU-8 wafers are observed starting from 275 degrees C. IR transmittance spectra measurements indicate the crosslinks inside SU-8 break and further bond failure is observed due to the large decomposition of epoxy rings and phenyl in plane bending above 275 degrees C. This research provides guidelines of material selection and bonding parameters for heterogeneous integration, 3DIC and MEMS applications using metal/adhesive hybrid bonding.
URI: http://dx.doi.org/10.1166/jnn.2011.4202
http://hdl.handle.net/11536/20561
ISSN: 1533-4880
DOI: 10.1166/jnn.2011.4202
期刊: JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume: 11
Issue: 8
起始頁: 6969
結束頁: 6972
Appears in Collections:Articles