Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chen, K. N.	en_US
dc.contributor.author	Chang, Y. J.	en_US
dc.contributor.author	Ko, C. T.	en_US
dc.contributor.author	Hsu, S. Y.	en_US
dc.contributor.author	Chen, H. Y.	en_US
dc.contributor.author	Hsiao, C.	en_US
dc.contributor.author	Yu, T. H.	en_US
dc.contributor.author	Chen, Y. H.	en_US
dc.contributor.author	Lo, W. C.	en_US
dc.date.accessioned	2014-12-08T15:28:41Z	-
dc.date.available	2014-12-08T15:28:41Z	-
dc.date.issued	2012	en_US
dc.identifier.isbn	978-1-4673-1137-3	en_US
dc.identifier.uri	http://hdl.handle.net/11536/20752	-
dc.language.iso	en_US	en_US
dc.title	Electrical Performances and Quality Investigations of Integrated Bonded Structures and TSVs for 3D Interconnects	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:000312547500035	-
顯示於類別：	會議論文