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dc.contributor.authorPearn, Wen-Leaen_US
dc.contributor.authorTai, Yu-Tingen_US
dc.contributor.authorHuang, Kai-Binen_US
dc.contributor.authorKu, Pin-Lunen_US
dc.date.accessioned2014-12-08T15:29:03Z-
dc.date.available2014-12-08T15:29:03Z-
dc.date.issued2011-08-01en_US
dc.identifier.issn2156-3950en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCPMT.2011.2134853en_US
dc.identifier.urihttp://hdl.handle.net/11536/20949-
dc.description.abstractThe technology of thin film transistor liquid crystal display (LCD) has become more popular due to great demand for worldwide consumer electronic products. Driver integrated circuit (IC) is a critical device that is embedded sophisticated circuits to drive panels. Since narrow border design on display products is current trend, dimensions of driver ICs are shrunken. In the high-density LCD driver ICs, the operation of wafer sawing is essential and needs accurate yield assessment. However, inevitable process variance changes could arise from sawing machine, material, operation, and workmanship, and may not be detected within short time. Conventionally, manufacturing yield is evaluated applying typical yield measure index method under the assumptions that the processes are stable and normal. To assess manufacturing yield for Gamma wafer sawing processes more accurately, we present a modified yield measure index method. Using the proposed method, the magnitudes of the undetected variance change, which are functions of the detection power of the S(2) chart, are incorporated into the evaluation of manufacturing yield. In addition, we demonstrate, mathematically, that the accommodation would not be affected by the scale parameter of Gamma distribution. For illustration purpose, a real-world case in a wafer sawing factory which is located on the Science-based Industrial Park in Hsinchu, Taiwan, is presented.en_US
dc.language.isoen_USen_US
dc.subjectCrackingen_US
dc.subjectgamma processen_US
dc.subjectmanufacturing yielden_US
dc.subjectS(2) charten_US
dc.subjectvariance changeen_US
dc.subjectwafer sawingen_US
dc.titleAccessing Manufacturing Yield for Gamma Wafer Sawing Processes in COG Packagingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCPMT.2011.2134853en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume1en_US
dc.citation.issue8en_US
dc.citation.spage1282en_US
dc.citation.epage1291en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000293752800019-
dc.citation.woscount2-
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