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dc.contributor.authorLin, Bo-Wenen_US
dc.contributor.authorNiu, Chen-Yien_US
dc.contributor.authorHsieh, Cheng-Yuen_US
dc.contributor.authorWang, Bau-Mingen_US
dc.contributor.authorHsu, Wen-Chingen_US
dc.contributor.authorLin, Ray-Mingen_US
dc.contributor.authorWu, Yew Chung Sermonen_US
dc.date.accessioned2014-12-08T15:29:30Z-
dc.date.available2014-12-08T15:29:30Z-
dc.date.issued2013-02-15en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2013.2238226en_US
dc.identifier.urihttp://hdl.handle.net/11536/21215-
dc.description.abstractWet-etching pattern sapphire substrates (PSS) have been used to grow GaN-based light-emitting diodes (LEDs). However, after wet etching, several sidewall facets are exposed on the patterns of PSS. These sidewall facets would grow zincblende GaN and form irregular voids. In this letter, BCl3-based plasma is used to solve this problem and improve the performance of GaN-based LEDs.en_US
dc.language.isoen_USen_US
dc.subjectBCl3en_US
dc.subjectlight-emitting diode (LED)en_US
dc.subjectpatternen_US
dc.subjectsapphireen_US
dc.titleUsing BCl3-Based Plasma to Modify Wet-Etching Pattern Sapphire Substrate for Improving the Growth of GaN-Based LEDsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2013.2238226en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume25en_US
dc.citation.issue4en_US
dc.citation.spage371en_US
dc.citation.epage373en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000314684400015-
dc.citation.woscount1-
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