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dc.contributor.authorChang, Kow-Mingen_US
dc.contributor.authorHo, Po-Chingen_US
dc.contributor.authorYang, Kuo-Huien_US
dc.contributor.authorWu, Shen-Binen_US
dc.contributor.authorLiu, Chi-Hungen_US
dc.date.accessioned2014-12-08T15:30:09Z-
dc.date.available2014-12-08T15:30:09Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-60768-317-9en_US
dc.identifier.issn1938-5862en_US
dc.identifier.urihttp://hdl.handle.net/11536/21601-
dc.identifier.urihttp://dx.doi.org/10.1149/1.3701534en_US
dc.description.abstractAn atmosphere pressure plasma (APP) deposition system with dielectric barrier discharge (DBD) is proposed for deposition selenium thin films on CuGa-In metallic precursors and transformed into Cu(In,Ga)Se-2 (CIGS) thin films by rapid thermal process (RTP). Morphologies and thicknesses of selenium thin films deposited on In/CuGa/Mo/SLG can be affected by plasma power which also has impact on crystallinity of CIGS absorber. With the increase in plasma power, CIGS grains tend to distribute non-uniformly. Plasma power of 100W has the smallest FWHM of the main peak (112). Insufficient selenium incorporation into precursors result in undesired phases such as Cu3Se2, Cu2Se and separation phase, CuGaSe2 compound. Compositions of optimal selenized CIGS thin film deposited by scanning 180times are Cu/(In+Ga) = 1.03 and Ga/(In+Ga) = 0.24.en_US
dc.language.isoen_USen_US
dc.titleCu(In,Ga)Se-2 thin films preparation from CuGa-In metallic alloy and Se thin film by atmosphere pressure plasma deposition systemen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1149/1.3701534en_US
dc.identifier.journalWIDE-BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 13en_US
dc.citation.volume45en_US
dc.citation.issue7en_US
dc.citation.spage143en_US
dc.citation.epage151en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000316687500016-
Appears in Collections:Conferences Paper


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