Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints

Title:	Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
Authors:	Liang, Y. C. Lin, H. W. Chen, H. P. Chen, C. Tu, K. N. Lai, Y. S. 材料科學與工程學系 Department of Materials Science and Engineering
Keywords:	Stress migration;Diffusion;Temperature cycling test;SnPb composite solder joint
Issue Date:	1-Jul-2013
Abstract:	The evolution of eutectic structure under temperature cycling tests (TCTs) in SnPb composite solder joints has been investigated. After 500 cycles of TCT, the Sn grains coarsened and developed anisotropic stripes close to the necking site in the solder joint because of stress-induced atomic migration. Then, cracks triggered by thermal stress were observed to propagate along the Sn stripe interfaces. After a prolonged 14,410 cycles of TCT, the cracks expanded across the entire solder joint and led to electrical open failure. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI:	http://dx.doi.org/10.1016/j.scriptamat.2013.03.018 http://hdl.handle.net/11536/21840
ISSN:	1359-6462
DOI:	10.1016/j.scriptamat.2013.03.018
Journal:	SCRIPTA MATERIALIA
Volume:	69
Issue:	1
Begin Page:	25
End Page:	28
Appears in Collections:	Articles

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