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dc.contributor.authorChang, Chih-Weien_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.date.accessioned2014-12-08T15:30:43Z-
dc.date.available2014-12-08T15:30:43Z-
dc.date.issued2013-04-01en_US
dc.identifier.issn1424-8220en_US
dc.identifier.urihttp://dx.doi.org/10.3390/s130404624en_US
dc.identifier.urihttp://hdl.handle.net/11536/21943-
dc.description.abstractThis paper presents the design and implementation of an integrated wireless microsystem platform that provides the possibility to support versatile implantable neural sensing devices in free laboratory rats. Inductive coupled coils with low dropout regulator design allows true long-term recording without limitation of battery capacity. A 16-channel analog front end chip located on the headstage is designed for high channel account neural signal conditioning with low current consumption and noise. Two types of implantable electrodes including grid electrode and 3D probe array are also presented for brain surface recording and 3D biopotential acquisition in the implanted target volume of tissue. The overall system consumes less than 20 mA with small form factor, 3.9 x 3.9 cm(2) mainboard and 1.8 x 3.4 cm(2) headstage, is packaged into a backpack for rats. Practical in vivo recordings including auditory response, brain resection tissue and PZT-induced seizures recording demonstrate the correct function of the proposed microsystem. Presented achievements addressed the aforementioned properties by combining MEMS neural sensors, low-power circuit designs and commercial chips into system-level integration.en_US
dc.language.isoen_USen_US
dc.subjectmicrosystemen_US
dc.subjectwirelessen_US
dc.subjectneural electrode arrayen_US
dc.subjectbiopotentialsen_US
dc.titleA Wireless and Batteryless Microsystem with Implantable Grid Electrode/3-Dimensional Probe Array for ECoG and Extracellular Neural Recording in Ratsen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/s130404624en_US
dc.identifier.journalSENSORSen_US
dc.citation.volume13en_US
dc.citation.issue4en_US
dc.citation.spage4624en_US
dc.citation.epage4639en_US
dc.contributor.department電機資訊學士班zh_TW
dc.contributor.departmentUndergraduate Honors Program of Electrical Engineering and Computer Scienceen_US
dc.identifier.wosnumberWOS:000318036400038-
dc.citation.woscount4-
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