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dc.contributor.authorTsai, Ming-Fuen_US
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorPao, Chia-Haoen_US
dc.contributor.authorChen, Yin-Nienen_US
dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2014-12-08T15:32:43Z-
dc.date.available2014-12-08T15:32:43Z-
dc.date.issued2013en_US
dc.identifier.isbn978-1-4673-3082-4en_US
dc.identifier.issn1524-766Xen_US
dc.identifier.urihttp://hdl.handle.net/11536/22860-
dc.description.abstractThis paper discusses the design and optimization of 6T SRAM cell using multiple stacked NanoWire (NW) MOSFETs. The results suggest that RSNM reaches the maximum when Pull-Up (PU) and Pull-Down (PD) transistors are stacked in equivalent number. Up to 40% and 91% improvement in RSNM are achieved at the cost of 7.5% and 5.9% degradation in WSNM using Floating-Power Write-assist compared with the case without stacking at V-DD = 0.3V and 1V, respectively. For robust design in subthreshold SRAM, raising V-trip by stacking PU transistors is more efficient than reducing Read disturb by stacking PD transistors under the premise of using quantized number of stacked NW. Moreover, we show that the stacked NW MOSFETs suppress the impact of Line-Edge Roughness (LER) variation and mitigate the variability in SRAM.en_US
dc.language.isoen_USen_US
dc.titleDesign and Optimization of 6T SRAM using Vertically Stacked Nanowire MOSFETsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS (VLSI-TSA)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000326324800059-
Appears in Collections:Conferences Paper