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dc.contributor.authorLuo, Wun-Chengen_US
dc.contributor.authorHou, Tuo-Hungen_US
dc.contributor.authorLin, Kuan-Liangen_US
dc.contributor.authorLee, Yao-Jenen_US
dc.contributor.authorLei, Tan-Fuen_US
dc.date.accessioned2014-12-08T15:33:38Z-
dc.date.available2014-12-08T15:33:38Z-
dc.date.issued2013-11-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.sse.2013.08.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/23293-
dc.description.abstractIn contrast to the irreversible transition of resistive switching induced by oxygen-vacancy filaments (VF) and metal filaments (MF) reported in the literature, this study reports coexistence and completely reversible transition of VF- and MF-induced resistive switching in a Ni/HfO2/SiOx/P+-Si device with three distinct and stable resistance states. In a dual filament model proposed, VF and MF may coexist at the same percolation path, and the formation and rupture proceed in a two-step fashion by choosing appropriate SET/RESET conditions. Exploiting the dependence of different filament compositions on resistive switching may enable new design space for future multi-level-cell resistive-switching memory. (C) 2013 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectRRAMen_US
dc.subjectFilamenten_US
dc.subjectMulti-level-cellen_US
dc.subjectResistive switchingen_US
dc.titleReversible transition of resistive switching induced by oxygen-vacancy and metal filaments in HfO2en_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.sse.2013.08.005en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume89en_US
dc.citation.issueen_US
dc.citation.spage167en_US
dc.citation.epage170en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000327291800027-
dc.citation.woscount0-
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