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dc.contributor.authorLee, Jen-Weien_US
dc.contributor.authorChung, Szu-Chien_US
dc.contributor.authorChang, Hsie-Chiaen_US
dc.contributor.authorLee, Chen-Yien_US
dc.date.accessioned2014-12-08T15:33:56Z-
dc.date.available2014-12-08T15:33:56Z-
dc.date.issued2014-01-01en_US
dc.identifier.issn1063-8210en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TVLSI.2013.2237930en_US
dc.identifier.urihttp://hdl.handle.net/11536/23391-
dc.description.abstractElliptic curve cryptography (ECC) for portable applications is in high demand to ensure secure information exchange over wireless channels. Because of the high computational complexity of ECC functions, dedicated hardware architecture is essential to provide sufficient ECC performance. Besides, crypto-ICs are vulnerable to side-channel information leakage because the private key can be revealed via power-analysis attacks. In this paper, a new heterogeneous dual-processing-element (dual-PE) architecture and a priority-oriented scheduling of right-to-left double-and-add-always EC scalar multiplication (ECSM) with randomized processing technique are proposed to achieve a power-analysis-resistant dual-field ECC (DF-ECC) processor. For this dual-PE design, a memory hierarchy with local memory synchronization scheme is also exploited to improve data bandwidth. Fabricated in a 90-nm CMOS technology, a 0.4-mm(2) 160-b DF-ECC chip can achieve 0.34/0.29 ms 11.7/9.3 mu J for one GF(p)/GF(2(m)) ECSM. Compared to other related works, our approach is advantageous not only in hardware efficiency but also in protection against power-analysis attacks.en_US
dc.language.isoen_USen_US
dc.subjectElliptic curve cryptography (ECC)en_US
dc.subjectdual fieldsen_US
dc.subjectheterogeneous processing-element architectureen_US
dc.subjectparallel computationsen_US
dc.subjectpower-analysis attacksen_US
dc.titleEfficient Power-Analysis-Resistant Dual-Field Elliptic Curve Cryptographic Processor Using Heterogeneous Dual-Processing-Element Architectureen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TVLSI.2013.2237930en_US
dc.identifier.journalIEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSen_US
dc.citation.volume22en_US
dc.citation.issue1en_US
dc.citation.spage49en_US
dc.citation.epage61en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000329067400005-
dc.citation.woscount0-
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