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dc.contributor.authorLIN, HCen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.authorCHEN, WHen_US
dc.contributor.authorTSAI, WCen_US
dc.contributor.authorCHANG, TCen_US
dc.contributor.authorJUNG, TGen_US
dc.contributor.authorLIN, HYen_US
dc.date.accessioned2014-12-08T15:03:48Z-
dc.date.available2014-12-08T15:03:48Z-
dc.date.issued1994-09-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/2342-
dc.description.abstractIn this study, the effects of different reactants, namely, SiH4, GeH4 and B2H6, on the nucleation and deposition of polycrystalline silicon-germanium (poly-Si1-xGe(x)) films on oxide surface in an ultrahigh vacuum chemical vapor deposition reactor were explored. The results show that the addition of GeH4 tends to retard the nucleation process of poly films while B2H6 is preferential for adsorbing on the oxide surface. These effects lead to different incubation duration depending on the kind of reactants used. On the deposition of poly-Si1-xGe(x) films, it is observed that the Ge incorporation is only slightly related to the substrate type, but the deposition mode of poly-Si1-xGe(x) films is much different from that of epitaxial growth on Si(100). The incorporation of Ge atoms also overcomes the anomalous doping effect encountered in heavily boron-doped poly-Si films and allows extremely low resistivity (below 2 mOMEGA-cm) poly films to be obtained at low temperatures (less-than-or-equal-to550-degrees-C).en_US
dc.language.isoen_USen_US
dc.titleEFFECTS OF SIH4, GEH4, AND B2H6 ON THE NUCLEATION AND DEPOSITION OF POLYCRYSTALLINE SI1-XGEX FILMSen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume141en_US
dc.citation.issue9en_US
dc.citation.spage2559en_US
dc.citation.epage2563en_US
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:A1994PG28600066-
dc.citation.woscount43-
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