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dc.contributor.authorJi, Lien_US
dc.contributor.authorChang, Yao-Fengen_US
dc.contributor.authorFowler, Burten_US
dc.contributor.authorChen, Ying-Chenen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorChen, Min-Chenen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorSze, Simon M.en_US
dc.contributor.authorYu, Edward T.en_US
dc.contributor.authorLee, Jack C.en_US
dc.date.accessioned2014-12-08T15:35:06Z-
dc.date.available2014-12-08T15:35:06Z-
dc.date.issued2014-02-01en_US
dc.identifier.issn1530-6984en_US
dc.identifier.urihttp://dx.doi.org/10.1021/nl404160uen_US
dc.identifier.urihttp://hdl.handle.net/11536/23827-
dc.description.abstractWe report on a highly compact, one diode-one resistor (1D-1R) nanopillar device architecture for SiOx-based ReRAM fabricated using nanosphere lithography (NSL). The intrinsic SiOx-based resistive switching element and Si diode are self-aligned on an epitaxial silicon wafer using NSL and a deep-Si-etch process without conventional photolithography. AC-pulse response in 50 ns regime, multibit operation, and good reliability are demonstrated. The NSL process provides a fast and economical approach to large-scale patterning of high-density 1D-1R ReRAM with good potential for use in future applications.en_US
dc.language.isoen_USen_US
dc.subject1D-1Ren_US
dc.subjectReRAMen_US
dc.subjectNanosphere Lithographyen_US
dc.subjectSiOxen_US
dc.subjectnanopillaren_US
dc.titleIntegrated One Diode-One Resistor Architecture in Nanopillar SiOx Resistive Switching Memory by Nanosphere Lithographyen_US
dc.typeArticleen_US
dc.identifier.doi10.1021/nl404160uen_US
dc.identifier.journalNANO LETTERSen_US
dc.citation.volume14en_US
dc.citation.issue2en_US
dc.citation.spage813en_US
dc.citation.epage818en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000331343900064-
dc.citation.woscount3-
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