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dc.contributor.authorCHYAN, YFen_US
dc.contributor.authorSZE, SMen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.authorCHIUEH, HMen_US
dc.contributor.authorREIF, Ren_US
dc.date.accessioned2014-12-08T15:03:51Z-
dc.date.available2014-12-08T15:03:51Z-
dc.date.issued1994-08-01en_US
dc.identifier.issn0038-1101en_US
dc.identifier.urihttp://dx.doi.org/10.1016/0038-1101(94)90161-9en_US
dc.identifier.urihttp://hdl.handle.net/11536/2382-
dc.description.abstractThis paper reports high-level injection influence on the high frequency performance in the polycrystalline silicon emitter bipolar transistors. Under high-level injection, the transconductance is not proportional to collector current. From the analysis, both the base resistance and the cutoff frequency are functions of terminal voltage, i.e. applied bias, and the maximum oscillation frequency is also a function of terminal voltage. By comparing these results obtained from the self-consistent high-level injection model considering injected charge storage (i.e. injected electron and hole concentrations comparable to doping concentrations in the base and emitter region) and base resistance with those results obtained from models which neglect the injected charge storage effect and/or the base resistance, it is found that both the injected charge storage effect and the base resistance must be considered to get accurate aforementioned device parameters.en_US
dc.language.isoen_USen_US
dc.titleHIGH-LEVEL INJECTION INFLUENCE ON THE HIGH-FREQUENCY PERFORMANCE OF POLYCRYSTALLINE SILICON EMITTER BIPOLAR-TRANSISTORSen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/0038-1101(94)90161-9en_US
dc.identifier.journalSOLID-STATE ELECTRONICSen_US
dc.citation.volume37en_US
dc.citation.issue8en_US
dc.citation.spage1531en_US
dc.citation.epage1536en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:A1994NN24900010-
dc.citation.woscount0-
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