EFFECTS OF THE COOLING RATE ON THE MECHANICAL AND ELECTRICAL BEHAVIOR OF A 63SN/37PB SOLDER BUMP ON A METALLIZED SI SUBSTRATE

doi:10.1007/BF00186191

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DC Field	Value	Language
dc.contributor.author	CHIOU, BS	en_US
dc.contributor.author	CHENG, JC	en_US
dc.date.accessioned	2014-12-08T15:03:52Z	-
dc.date.available	2014-12-08T15:03:52Z	-
dc.date.issued	1994-08-01	en_US
dc.identifier.issn	0957-4522	en_US
dc.identifier.uri	http://dx.doi.org/10.1007/BF00186191	en_US
dc.identifier.uri	http://hdl.handle.net/11536/2390	-
dc.description.abstract	Flip-chip bonding technology, with solder bumps deposited on metal terminals on the chip, provides the highest functional densities of all the present bonding techniques. In this study, tin-lead solder bumps were screen printed onto a metallized Si substrate. Various cooling rates were employed after reflowing the solder bumps. The effect of the cooling rate on the microhardness, the adhesion strength and the electrical resistance of solder joints was studied and the mechanism explored. It was found that intermetallic compounds play important roles in both the mechanical and the electrical behaviour of the solder bumps.	en_US
dc.language.iso	en_US	en_US
dc.title	EFFECTS OF THE COOLING RATE ON THE MECHANICAL AND ELECTRICAL BEHAVIOR OF A 63SN/37PB SOLDER BUMP ON A METALLIZED SI SUBSTRATE	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1007/BF00186191	en_US
dc.identifier.journal	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS	en_US
dc.citation.volume	5	en_US
dc.citation.issue	4	en_US
dc.citation.spage	229	en_US
dc.citation.epage	234	en_US
dc.contributor.department	電子工程學系及電子研究所	zh_TW
dc.contributor.department	Department of Electronics Engineering and Institute of Electronics	en_US
dc.identifier.wosnumber	WOS:A1994PD44200008	-
dc.citation.woscount	2	-
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