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dc.contributor.authorLiu, Kuan-Hsienen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorHsieh, Tien-Yuen_US
dc.contributor.authorChen, Min-Chenen_US
dc.contributor.authorYeh, Bo-Liangen_US
dc.contributor.authorChou, Wu-Chingen_US
dc.date.accessioned2014-12-08T15:35:26Z-
dc.date.available2014-12-08T15:35:26Z-
dc.date.issued2014-03-10en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4863682en_US
dc.identifier.urihttp://hdl.handle.net/11536/23985-
dc.description.abstractThis study investigates the electrical instability under negative gate bias stress (NGBS) induced by surface hydrolysis effect. Electrical characteristics exhibit instability for amorphous InGaZnO (a-IGZO) Thin Film Transistors (TFTs) under NGBS, in which on-current degradation and current crowding phenomenon can be observed. When the negative gate bias is applied on the TFT, hydrogen ions will dissociate from ZnO-H bonds and the dissociated hydrogen ions will cause electrical instability under NGBS. The ISE-Technology Computer Aided Design simulation tool and moisture partial pressure modulation measurement are utilized to clarify the anomalous degradation behavior. (C) 2014 AIP Publishing LLC.en_US
dc.language.isoen_USen_US
dc.titleInvestigation of on-current degradation behavior induced by surface hydrolysis effect under negative gate bias stress in amorphous InGaZnO thin-film transistorsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.4863682en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume104en_US
dc.citation.issue10en_US
dc.citation.epageen_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000333082800075-
dc.citation.woscount6-
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