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dc.contributor.authorLiu, Chien-Minen_US
dc.contributor.authorLin, Han-Wenen_US
dc.contributor.authorChu, Yi-Chengen_US
dc.contributor.authorChen, Chihen_US
dc.contributor.authorLyu, Dian-Rongen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.contributor.authorTu, K. N.en_US
dc.date.accessioned2014-12-08T15:35:49Z-
dc.date.available2014-12-08T15:35:49Z-
dc.date.issued2014-05-01en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.scriptamat.2014.01.040en_US
dc.identifier.urihttp://hdl.handle.net/11536/24211-
dc.description.abstractWe achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 degrees C at a stress of 114 psi for 30 min at 10(-3) torr. The temperature is lower than the reflow temperature of 250 degrees C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectCu-to-Cu direct bondingen_US
dc.subjectCreepen_US
dc.subjectDiffusionen_US
dc.subjectPreferred orientationen_US
dc.titleLow-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfacesen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.scriptamat.2014.01.040en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume78-79en_US
dc.citation.issueen_US
dc.citation.spage65en_US
dc.citation.epage68en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000334138900017-
dc.citation.woscount2-
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