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dc.contributor.authorTu, CHen_US
dc.contributor.authorChang, TCen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorZan, HWen_US
dc.contributor.authorTai, YHen_US
dc.contributor.authorYang, CYen_US
dc.contributor.authorWu, YCen_US
dc.contributor.authorLiu, HCen_US
dc.contributor.authorChen, WRen_US
dc.contributor.authorChang, CYen_US
dc.date.accessioned2014-12-08T15:36:05Z-
dc.date.available2014-12-08T15:36:05Z-
dc.date.issued2005en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/24425-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1996508en_US
dc.description.abstractFluorine (F)-implanted polycrystalline silicon thin-film transistor (poly-Si TFT) are proposed for the enhancement of device performance. A significant improvement in electrical characteristics, such as I-ON/I-OFF ratio, and field effect mobility, can be realized in the new thin-film transistor. The field effect mobility for F-implanted poly-Si TFTs is 53.82 cm(2)/V-s, and higher than 19.74 cm(2)/V-s in conventional SPC poly-Si TFTs. Furthermore, the F-implanted poly- Si TFT exhibits high immunity against hot carrier effect and improved electrical reliability. The manufacturing processes are simple and without additional thermal annealing steps, thereby compatible with the conventional TFT fabrication processes. (c) 2005 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleEnhanced performance of poly-Si thin film transistors using fluorine ions implantationen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1996508en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume8en_US
dc.citation.issue9en_US
dc.citation.spageG246en_US
dc.citation.epageG248en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231259500037-
dc.citation.woscount14-
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