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dc.contributor.authorHung, Chung Jungen_US
dc.contributor.authorHuang, Yi Hsuanen_US
dc.contributor.authorChen, Chih Haoen_US
dc.contributor.authorLin, Pangen_US
dc.contributor.authorTseng, Tseung Yuenen_US
dc.date.accessioned2014-12-08T15:36:06Z-
dc.date.available2014-12-08T15:36:06Z-
dc.date.issued2014-05-01en_US
dc.identifier.issn2156-3950en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TCPMT.2014.2299554en_US
dc.identifier.urihttp://hdl.handle.net/11536/24443-
dc.description.abstractFacile and cost-efficient hydrothermally grown 3-D tungsten trioxide (WO3) nanowires (NWs) network film on seed-free fluorine-doped tin oxide (FTO) substrates without using additive or capping agent is reported. The NW networks are hexagonal phase and the morphologies are changed by adjusting the pH of precursor solutions. Growth mechanism of WO3 NWs is also extensively discussed. The designed porous film exhibits remarkable enhancement of the electrochromic (EC) properties. In particular, a significant optical modulation (57% at 632 nm), fast color switching speed (bleaching: 7 s and coloration: 21 s), high coloration efficiency (120.3 cm(2) C-1 at 632 nm), high Li+ diffusion coefficient (2.14 x 10(-9) cm(2) s(-1)), and excellent cycling stability (87% after 1000 cycles) are achieved for the 3-D NWs film. The improved EC properties are mainly attributed to the highly porous film, which makes the Li+ diffusion becomes easier and provides larger specific surface area for charge-transfer reactions. Furthermore, we also reported an EC device (50 mm x 50 mm) with a simple two-electrode configuration showing high optical contrast. The 3-D WO3 NWs network film acts as an excellent EC material.en_US
dc.language.isoen_USen_US
dc.subjectElectrochromic deviceen_US
dc.subjectgrowth mechanismen_US
dc.subjectnanowireen_US
dc.subjecttungsten trioxideen_US
dc.titleHydrothermal Formation of Tungsten Trioxide Nanowire Networks on Seed-Free Substrates and Their Properties in Electrochromic Deviceen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TCPMT.2014.2299554en_US
dc.identifier.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYen_US
dc.citation.volume4en_US
dc.citation.issue5en_US
dc.citation.spage831en_US
dc.citation.epage839en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000336320900009-
dc.citation.woscount1-
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