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dc.contributor.authorChen, CWen_US
dc.contributor.authorChang, TCen_US
dc.contributor.authorLiu, PTen_US
dc.contributor.authorLu, HYen_US
dc.contributor.authorTsai, TMen_US
dc.contributor.authorWeng, CFen_US
dc.contributor.authorHu, CWen_US
dc.contributor.authorTseng, TYen_US
dc.date.accessioned2014-12-08T15:36:06Z-
dc.date.available2014-12-08T15:36:06Z-
dc.date.issued2005en_US
dc.identifier.issn1099-0062en_US
dc.identifier.urihttp://hdl.handle.net/11536/24448-
dc.identifier.urihttp://dx.doi.org/10.1149/1.1960173en_US
dc.description.abstractThe degradation of n-channel poly-silicon thin film transistor (poly-Si TFT) has been investigated under dynamic voltage stress. The ON-current of TFT is 0.03 times the initial value after 1000 s stress. However, both the sub-threshold swing and threshold voltage almost kept well during the ac stress. The current crowding effect was rapidly increased with the increasing of stress duration. The creation of effective trap density in tail-states of poly-Si film is responsible for the electrical degradation of poly-Si TFT. Moreover, the damaged regions were evidenced to be mainly near the source/drain regions according to the electrical analyses. (c) 2005 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleElectrical degradation of N-channel poly-Si TFT under AC stressen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/1.1960173en_US
dc.identifier.journalELECTROCHEMICAL AND SOLID STATE LETTERSen_US
dc.citation.volume8en_US
dc.citation.issue9en_US
dc.citation.spageH69en_US
dc.citation.epageH71en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000231259500039-
dc.citation.woscount8-
顯示於類別:期刊論文